Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...
This concentration on digital strategies equips students with skills and tools required for effective engineering and supply chain management when competing in an increasingly digital economy, with ...
A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.
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