Vision Components is presenting its VCSBC EvoCam at Embedded World 2026. For use in smart devices and industrial applications, it runs on the MediaTek Genio 510 processor.

The jointly developed camera family transmits QHD video over unshielded twisted pair (UTP) or low-cost coaxial links, enabled by Valens’ VA7000 A-PHY devices.

BeagleY‑AI from BeagleBoard couples a quad‑core Arm® Cortex®‑A53 with dual C7x DSP AI accelerators (4 TOPS combined), a 50 GFLOP GPU, and modern I/O.

At MWC 2026, Fibocom introduced its next-generation AI Electronic Cash Register (ECR) solution for automated and smart retail ...

Teledyne FLIR OEM has designed its Lepton XDS compact thermal and visible camera for space- and power-constrained products.

MIPI UniPro v3.0 and M-PHY v6.0 accelerate JEDEC UFS performance for edge AI in mobile, PC and automotive, and enable twice the previous data rate and gains in efficiency and scalability for flash ...

Tecno’s new modular phone concept pairs a super-thin base phone with a range of magnetically attachable camera modules ...

The post Xiaomi 17 Ultra Leica Edition Camera Superphone Goes Global Under a Different Name appeared first on Android ...

Teledyne FLIR OEM introduces the Lepton XDS, a compact dual thermal-visible camera module featuring MSX technology and Prism ISP.

Last year at the MWC, we got some hands-on time with a curious prototype – the Xiaomi Modular Optical System. Xiaomi described it as a research project, so its future was uncertain. However, Digital ...

In stock at authorised distributor Mouser Electronics are the new RA8D2 microcontrollers (MCUs) from Renesas Electronics.

I love the camera, but I can't believe the battery life from the Xiaomi 17 Ultra ...