TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to ...
Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, ...
AMD has been granted a patent (12080632) that covers glass core substrate technology. For those who came in late, glass substrates, made from materials like borosilicate, quartz, and fused silica, ...
A new material for flexible electronics could enable multilayered, recyclable electronic devices and help limit e-waste. Electronic waste, or e-waste, is a rapidly growing global problem, and it's ...
Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...
Sumitomo Chemical Chairman Keiichi Iwata (left) and Samsung Electro-Mechanics President Duckhyun Chang sign an MOU. The joint venture MOU is part of a strategy to overcome the limitations of package ...
The joint venture MOU is part of a strategy to overcome the limitations of package substrate technology amid the rapid advancement of artificial intelligence (AI) and high-performance computing (HPC).
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