Defects and contamination on the wafer can slow process development times and limit performance and yield. As chips get more complex, more defects can become buried within the increasing number of ...

A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...

Read more about meeting the individual challenges of digital zero-defect testing and details of approaches to dealing with these challenges. The effectiveness of semiconductor manufacturing test has a ...

At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...