Ironwood Electronics has unveiled a QFN socket design for the 9.1 x 14-mm package size. The SMP-QFN-8019 socket employs high-performance elastomer that facilitates very low inductance, high endurance, ...

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

Suited for high-temperature burn-in PC board testing, design stage component testing/evaluation, and burn-in ovens, Sullins transistor sockets, axial sockets, MOSFET sockets, and other custom test ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...