The verification gap emerges not from a lack of computational power but from the multiphysics nature of 3D-IC behavior.

3D-IC designs enable improvements in performance, power, footprint, and costs that cannot be attained in system-on-chip (SoC) and IC design. However, the leap from traditional SoC/IC design to 3D-IC ...

IC design and verification are arguably two of the most compute-intensive design tasks for engineers, and EDA vendors are infusing artificial intelligence (AI) into design software to address ...

Synopsys, Inc. announced that United Microelectronics Corporation (UMC) has selected Synopsys’ IC Validator physical verification product for lithography hot-spot checking at the 28-nm process node.

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

Skilled engineers remain the driving force for innovation in chips. But it’s no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design ...

Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU‑accelerated ...

The company’s recent partnership with Samsung Foundry will help test and simulate the 2nm process designs better and faster.

LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global electronic design automation market is expected to grow at a CAGR of more than 5% during the forecast ...

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...