System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

A large lot of plastic-packaged ICs is on its way to surface-mounting. The components have passed electrical inspection, where those having functional defects were removed. They have passed optical ...

Easy-to-mold conductive polypropylene (PP) compounds have typical melt flows of 20 gm/ 10 min (2,160 gm at 230°C). Easy-to-mold conductive polypropylene (PP) compounds have typical melt flows of 20 gm ...

Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...

Compression molding involves forming of complex shaped components by molding of a charge of fiber reinforced prepreg bulk molding compound (BMC) under heat and high pressures. Unidirectional fiber ...