Researchers propose low-latency topologies and processing-in-network as memory and interconnect bottlenecks threaten inference economic viability ...

As enterprises seek alternatives to concentrated GPU markets, demonstrations of production-grade performance with diverse ...

Transformative Micron MRDIMMs power memory-intensive applications like AI and HPC with up to 256GB capacity at 40% lower latency BOISE, Idaho, July 16, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc.

The biggest challenge posed by AI training is in moving the massive datasets between the memory and processor.

“Micron’s latest innovative main memory solution, MRDIMM, delivers the much-needed bandwidth and capacity at lower latency to scale AI inference and HPC applications on next-generation server ...

As GPU’s become a bigger part of data center spend, the companies that provide the HBM memory needed to make them sing are benefitting tremendously. AI system performance is highly dependent on memory ...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Enfabrica Corporation, an industry leader in high-performance networking silicon for artificial intelligence (AI) and accelerated computing, today announced the ...

“The rapid growth of LLMs has revolutionized natural language processing and AI analysis, but their increasing size and memory demands present significant challenges. A common solution is to spill ...

This is the third and final of a series from Alphawave Semi on HBM4 and gives and examines custom HBM implementations. Click here for part 1, which gives an overview of the HBM standard, and here for ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced its most advanced ...

BOISE, Idaho, July 16, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (MU), today announced it is now sampling its multiplexed rank dual inline memory module (MRDIMMs). The MRDIMMs will enable ...