Test Socket's CAM Lid Guards Package Pads Damage to package pads is preventable thanks to a line of high-frequency test sockets. These sockets feature a computing-aided manufacturing (CAM) lid that ...
RTI 900-113X pogo pin test sockets accommodate QFN, LLP, QFP, BGA, LGA, and other low-pin-count device packages ranging in size from 1 mm to 12 mm with pitches of 0.4 mm and larger. Lid styles include ...
The company's BGA and mBGA Quick Lock Sockets rely on a unique cover design that promises both easy and swift access to the device without the need for tools to actuate or secure the lid. Once the ...
Ironwood Electronics has released a new test socket for BGA devices; it features a clamshell lid design for ease of chip replacement in the production environment. Besides final production test, the ...
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