“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

A joint project to optimize injection molding using flow simulation data has produced actual process performance nearly identical to the modeled performance, according to Oerlikon HRSflow. The ...

The Turbo Package Analyzer TPA v5 IC packaging tool features a new automation, design flow, and simulation capability needed to extract the electrical characteristics of complex high-performance BGA ...

PITTSBURGH, Oct. 17, 2019 /PRNewswire/-- Samsung Foundry certified ANSYS (NASDAQ: ANSS) multiphysics simulation solutions for its latest multi-die integration TM (MDI ...

Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...

When it comes to molding processes in plastics manufacturing, achieving a consistent flow can sometimes feel like trying to steer a ship through rocky waters. The secret to success lies in mastering ...

CoreTech System Co. Ltd. has expanded its capabilities to encompass the entire product development life cycle from prototyping and tooling to processing. CoreTech (S15019) was founded in 1995 in ...

Have you ever wondered how to eliminate internal delamination inside your semiconductor package, or how to reduce warpage of your large ball-grid array (BGA) package to eliminate non-wets during board ...

As Industrial 4.0 and smart manufacturing emerge, the integration of virtuality and reality has become the mainstream. This trend has subsequently brought changes to the landscape of industrial ...

The worldwide sensor market is growing by leaps and bounds. Indicative of that trend, analysts following large mainstream industries such as automotive manufacturers are now predicting that cars five ...