SANTA CLARA, Calif. and VANCOUVER, Wash., Nov. 8, 2007 – Antares Advanced Test Technologies, a global supplier of integrated semiconductor-test consumables focused on maximizing chipmakers' production ...
The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and ...
Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...
New and resurrected packages, along with innovative technologies, are leading the way to IC packages with more than 2000 I/O leads and 40 to 50W dissipation. EDA vendors are also supporting package ...
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