AUSTIN, Texas--(BUSINESS WIRE)--3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic ...

Lextar Electronics will debut a package-free "white chip" LED technology that features substrate-free flip chip and phosphor molding process, and can be fabricated by ...

YOUNGIN-SI, South Korea, Nov. 11, 2020 /PRNewswire/ -- Semicon Light plans to actively respond to the patents to protect the original technology, "Silver- Free Flip Chip LED". Semicon Light, a company ...

SEOUL, South Korea, Jan. 18, 2018 /PRNewswire/ -- LG Innotek today announced that it had succeeded in developing an 'advanced flip chip LED package' that demonstrates high efficiency and high luminous ...

IBM Corp. is collaborating with several leading packaging and test services providers to market the second generation of its Surface Laminar Circuit flip-chip packaging technology. IBM will supply ...

Genesis Photonics Inc. (GPI), which has been devoted to developing LED epitaxial wafer and chip technology for over 10 years, has made great strides in flip-chip packaging. GPI has developed MATCH LED ...

Editor’s preface: There is increasing interest in the ‘new’ smart card chip manufacturing technique known as Flip Chip. An alternative to the tradional manufacturing process that attached chips to ...

Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor continues to grow for mobile, network and consumer devices. While the increase in ...

The Electronics Materials Solutions division of industrial goods manufacturer 3M Company ( MMM) recently introduced a new LED (light emitting diode) chip packaging substrate in order to lower the ...

Aladdin introduces an updated and improved MCOB (multi chip on board) LED light source on ceramic substrate that offers higher efficiency than its predecessors and world class thermal properties as ...

Kyocera America Inc., a subsidiary of Kyocera International Inc., today introduced what it said is the first flip-chip build-up substrate that is capable of withstanding 260 degrees C solder reflow ...