Genesis Photonics Inc. (GPI), which has been devoted to developing LED epitaxial wafer and chip technology for over 10 years, has made great strides in flip-chip packaging. GPI has developed MATCH LED ...
YOUNGIN-SI, South Korea, Nov. 11, 2020 /PRNewswire/ -- Semicon Light plans to actively respond to the patents to protect the original technology, "Silver- Free Flip Chip LED". Semicon Light, a company ...
SEOUL, South Korea, Jan. 18, 2018 /PRNewswire/ -- LG Innotek today announced that it had succeeded in developing an 'advanced flip chip LED package' that demonstrates high efficiency and high luminous ...
Fujitsu Limited announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps (*1), and high-precision flip-chip ...
Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...
New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback