LAUSANNE, Switzerland & SAN JOSE, Calif.--(BUSINESS WIRE)--Logitech International (SIX: LOGN) (Nasdaq: LOGI) today announces significant progress in eliminating plastic clamshell packaging from its ...
Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback