Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...

This article is part of the Technology Insight series, made possible with funding from Intel. We tend to focus on the latest and greatest technology nodes because they’re used to manufacture the ...

Recently, reports indicated that Intel outsourced its high-end EMIB chip packaging to Amkor Technology for the first time, using Amkor’s advanced facility in South Korea. This move highlights Amkor’s ...

Supports latest interconnect standards, including Universal Chiplet Interconnect Express™ 2.0 and Open Compute Project Bunch of Wires, for improved design flexibility Enhances Keysight’s EDA standards ...

Intel is unveiling packaging innovations for creating three-dimensional chip packages and other solutions that put together multiple chips. In advance of the Semicon West conference in San Francisco, ...

The artificial intelligence (AI) revolution has expanded rapidly since 2023, powering applications from chatbots to ...

Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect Bridge (EMIB) ...

Amkor Technology (AMKR) just scored a meaningful win, with Intel tapping it to handle EMIB advanced packaging work for the first time, alongside upbeat third quarter results that have clearly caught ...

Intel is expanding its advanced packaging arsenal in an effort to reestablish its lead in chip manufacturing technology. Intel has introduced three new technologies for building chips out of smaller ...

We are in the era of chiplet designs, and given the growing complexity of today's silicon solutions, that is unlikely to change anytime soon. Along those lines, one thing Intel says often gets ...

Intel has released details on a new interconnect approach that it's using for future FPGAs, and could make available in CPUs as well, if demand is significant. Share on Facebook (opens in a new window ...

Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...